4 Layeri ENIG FR4 Igice cya Hole PCB

Gucukura - Umuringa wa Shimi - Umuringa wuzuye wuzuye - Kwimura amashusho - Igishushanyo cya Electroplating - Defilm - Etching - Soldch Soldering - Igice cya Hole Surface Coating (Ifite mugihe kimwe hamwe numwirondoro).

Umwobo wacuzwe igice cyaciwemo kabiri nyuma yumwobo uzengurutse.Biroroshye kugaragara ibintu bisigara byumuringa wumuringa hamwe nuruhu rwumuringa kurigata mu mwobo wigice, bigira ingaruka kumikorere yumwobo wigice kandi bigatuma igabanuka ryibikorwa byumusaruro.Kugirango tuneshe inenge zavuzwe haruguru, bizakorwa hakurikijwe inzira zikurikira za metallised semi-orifice PCB ：

1. Gutunganya igice cyumwobo kabiri V icyuma.

2. Mu myitozo ya kabiri, umwobo uyobora wongeyeho ku nkombe y’umwobo, uruhu rwumuringa rukurwaho mbere, kandi burr iragabanuka.Amashanyarazi akoreshwa mugucukura kugirango yongere umuvuduko wo kugwa.

3. Isahani y'umuringa kuri substrate, ku buryo igice cy'umuringa gikozwe ku rukuta rw'umwobo rw'umwobo uzengurutse ku nkombe y'isahani.

4. Umuzenguruko w'inyuma ukorwa na firime yo guhunika, kwerekana no guteza imbere substrate nayo, hanyuma substrate igashyirwaho umuringa na tin kabiri, kuburyo umuringa wumuringa kurukuta rwumwobo wurwobo ruzengurutse kuruhande rwa isahani irabyimbye kandi umuringa utwikiriwe na tin layer hamwe ningaruka zo kurwanya ruswa;

5. Igice cya kabiri kigize isahani yizengurutse umwobo uciwemo kabiri kugirango ugire igice cyacyu;

6. Gukuraho firime bizakuraho firime anti-plating ikanda mugikorwa cyo gukanda film;

7. Kuramo substrate, hanyuma ukureho umuringa wagaragaye hejuru yumurongo winyuma wa substrate nyuma yo gukuramo firime; Amabati yo gukuramo amabati Substrate irashwanyaguzwa kugirango amabati akurwe kurukuta rwacukuwe nigice cyumuringa kuri kimwe cya kabiri- urukuta rusobekeranye ruragaragara.

8. Nyuma yo kubumba, koresha kaseti itukura kugirango uhuze ibyapa hamwe, no hejuru yumurongo wa alkaline kugirango ukureho burrs

9. Nyuma yumuringa wa kabiri wumuringa hamwe namabati yometse kuri substrate, umwobo uzenguruka kumpera yisahani ucibwamo kabiri kugirango ube umwobo.Kuberako umuringa wurukuta rwumwobo utwikiriwe na tin layer, kandi umuringa wumuringa wurukuta rwumwobo uhujwe rwose numuringa wumuringa wurwego rwinyuma rwa substrate, kandi imbaraga zihuza nini, umuringa kumurongo. urukuta rushobora kwirindwa neza mugihe cyo gutema, nko gukuramo cyangwa ibintu byo gufata umuringa;

10. Nyuma yo kurangiza igice cy-umwobo hanyuma ugakuraho firime, hanyuma etch, okiside yumuringa ntishobora kubaho, wirinde neza ko habaho ibisigisigi byumuringa ndetse nibintu bito byumuzunguruko, byongera umusaruro wibyuma bya PCB byacuzwe. .