8 Layeri ENIG FR4 Binyuze muri-Pad PCB
Ikintu kigoye cyane kugenzura umwobo wacometse muri pade ni umupira ugurisha cyangwa padi kuri wino mu mwobo.Bitewe no gukoresha ubucucike bwinshi BGA (ball grid array) hamwe na miniaturizasi ya chip ya SMD, ikoreshwa rya tekinoroji ya tray ni byinshi kandi byinshi.Binyuze mu kwizerwa binyuze muburyo bwo kuzuza umwobo, tekinoroji ya plaque irashobora gukoreshwa mugushushanya no gukora ikibaho kinini cyane, kandi wirinde gusudira bidasanzwe.Inzira ya HUIHE imaze imyaka myinshi ikoresha tekinoroji ya padiri, kandi ifite inzira nziza kandi yizewe.
Ibipimo Binyuze muri-Pad PCB
| Ibicuruzwa bisanzwe | Ibicuruzwa bidasanzwe | Ibicuruzwa bidasanzwe | |
| Ibipimo byuzuye | IPC 4761 Ubwoko bwa VII | IPC 4761 Ubwoko bwa VII | - |
| Umwanya muto | 200µm | 150µm | 100µm |
| Ingano ntoya | 400µm | 350µm | 300µm |
| Ikiraro kinini | 500µm | 400µm | - |
| Ingano ntarengwa | 700µm | 600µm | - |
| Ikibanza ntarengwa | 600µm | 550µm | 500µm |
| Ikigereranyo cya Aspect Ibisanzwe binyuze | 1:12 | 1:12 | 1:10 |
| Igipimo cya Aspect ind Impumyi binyuze | 1: 1 | 1: 1 | 1: 1 |
Imikorere yo gucomeka
1.Kurinda amabati kunyura mu mwobo uyobora unyuze hejuru yibice mugihe cyo kugurisha
2. Irinde ibisigisigi bya flux mu mwobo
3.Kwirinda imipira yamabati gusohoka mugihe cyo kugurisha imiraba, bikavamo umuzenguruko muto
4.Kwirinda kugurisha ibicuruzwa byo hejuru bitembera mu mwobo, bigatera gusudira muburyo kandi bikagira ingaruka
Ibyiza bya Via-Muri-Pad PCB
1.Gutezimbere ubushyuhe
2.Umuvuduko wihanganira ubushobozi bwa vias uratera imbere
3. Tanga ubuso bunoze kandi buhoraho
4. Induction ya parasitike yo hasi
Ibyiza byacu
1. Uruganda nyirizina, ubuso bwa metero kare 12000, kugurisha uruganda
2. Itsinda ryamamaza ritanga serivisi yihuse kandi yujuje ubuziranenge mbere yo kugurisha na nyuma yo kugurisha
3.Ibikorwa bishingiye kubikorwa byo gutunganya amakuru ya PCB kugirango tumenye neza ko abakiriya bashobora gusuzuma no kwemeza mugihe cyambere
