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10 Layeri ENIG FR4 Binyuze muri Pad PCB

10 Layeri ENIG FR4 Binyuze muri Pad PCB

Ibisobanuro bigufi:

Igice: 10
Kurangiza hejuru: ENIG
Ibikoresho: FR4 Tg170
Umurongo wo hanze W / S: 10 / 7.5mil
Umurongo w'imbere W / S: 3.5 / 7mil
Ubunini bwibibaho: 2.0mm
Min.umwobo wa diameter: 0.15mm
Gucomeka umwobo: ukoresheje kuzuza isahani


Ibicuruzwa birambuye

Binyuze muri Pad PCB

Mu gishushanyo cya PCB, unyuze mu mwobo ni spacer ifite umwobo muto ushyizwe mu kibaho cyacapwe kugirango uhuze imirongo y'umuringa kuri buri cyiciro.Hariho ubwoko bwanyuze mu mwobo bita microhole, ifite gusa umwobo uhumye ugaragara hejuru yubuso bwa aUbucucike bwinshi cyane PCBcyangwa umwobo utagaragara ushyinguwe hejuru.Intangiriro hamwe nogukoresha kwinshi kwinshi cyane pin ibice, kimwe no gukenera PCBS ntoya, yazanye ibibazo bishya.Kubwibyo, igisubizo cyiza kuri iki kibazo ni ugukoresha ikoranabuhanga rigezweho ariko ryamamaye rya PCB ryitwa "Via in Pad".

Mubishushanyo bya PCB byubu, gukoresha byihuse binyuze muri padi birasabwa kubera kugabanuka kwintera yikirenge cyibice hamwe na miniaturizasi ya coefficient ya PCB.Icy'ingenzi cyane, ituma inzira yerekana inzira mubice bike byimiterere ya PCB bishoboka kandi, mubihe byinshi, ndetse ikirinda kurenga perimeteri ikoreshwa nigikoresho.

Kwambukiranya padi ni ingirakamaro cyane muburyo bwihuse kuko bigabanya uburebure bwumurongo bityo inductance.Byaba byiza ugenzuye kugirango urebe niba uruganda rwa PCB rufite ibikoresho bihagije byo gukora ikibaho, kuko ibi bishobora gutwara amafaranga menshi.Ariko, niba udashobora gushyira mumashanyarazi, shyira muburyo butaziguye kandi ukoreshe ibirenze kugirango ugabanye inductance.

Mubyongeyeho, pasiporo irashobora kandi gukoreshwa mugihe habaye umwanya udahagije, nko mubishushanyo bya micro-BGA, bidashobora gukoresha uburyo bwa gakondo bwabafana.Ntagushidikanya ko inenge zinyuze mu mwobo muri disiki yo gusudira ari nto, kubera porogaramu muri disiki yo gusudira, ingaruka ku giciro ni kinini.Ingorabahizi yuburyo bwo gukora nigiciro cyibikoresho byibanze nibintu bibiri byingenzi bigira ingaruka kumusaruro wuzuza ibintu.Ubwa mbere, Via muri Pad nintambwe yinyongera mubikorwa byo gukora PCB.Ariko, uko umubare wibice bigabanuka, nigiciro cyinyongera kijyanye na Via mubuhanga bwa Pad.

Ibyiza Binyuze muri Pad PCB

Binyuze muri padi PCBs bifite ibyiza byinshi.Ubwa mbere, byorohereza ubwinshi bwubwinshi, ikoreshwa ryibikoresho byiza, kandi bigabanya inductance.Niki kirenzeho, mugikorwa cyo kunyura muri padi, unyuze ushyirwa munsi yumwanya wibikoresho byigikoresho, gishobora kugera kubice byinshi byubwinshi hamwe ninzira nziza.Irashobora rero kuzigama umwanya munini wa PCB hamwe na padi kubashushanya PCB.

Ugereranije na viasi zihumye hamwe na viasi zashyinguwe, ukoresheje padi ufite ibyiza bikurikira:

Bikwiranye nintera irambuye BGA;
Kunoza ubucucike bwa PCB, uzigame umwanya;
Kongera ubushyuhe;
Igorofa na coplanar hamwe nibikoresho bigize ibikoresho biratangwa;
Kuberako nta kimenyetso cyimbwa yamagufwa yimbwa, inductance iri hasi;
Ongera ubushobozi bwa voltage yicyambu;

Binyuze muri Pad Porogaramu Kuri SMD

1. Shira umwobo hamwe na resin hanyuma ushyireho umuringa

Bihujwe na BGA VIA nto muri Pad;Ubwa mbere, inzira ikubiyemo kuzuza umwobo ibikoresho bitwara cyangwa bitayobora, hanyuma ugashyiraho umwobo hejuru kugirango utange ubuso bunoze hejuru yubudodo.

Umwobo unyuramo ukoreshwa mugushushanya kugirango ushire ibice kumwobo cyangwa kwagura abagurisha guhuza umwobo.

2. Microholes nu mwobo bishyizwe kuri padi

Microholes ni IPC ishingiye ku mwobo ufite diameter iri munsi ya 0.15mm.Irashobora kuba inyuze mu mwobo (ifitanye isano na aspect ratio), ariko, mubisanzwe microhole ifatwa nkumwobo uhumye hagati yibice bibiri;Hafi ya microholes zacukuwe na laseri, ariko bamwe mubakora PCB nabo barimo gucukura nibikoresho bya mashini, bitinda ariko bigacibwa neza kandi bisukuye;Microvia Cooper Yuzuza inzira nuburyo bwo kubitsa amashanyarazi kubikorwa byinshi byo gukora PCB, bizwi kandi nka Capped VIas;Nubwo inzira igoye, irashobora gukorwa muri HDI PCBS ko abakora PCB benshi bazuzura umuringa wa microporome.

3. Funga umwobo hamwe na welding layer layer

Nubuntu kandi burahujwe nugurisha manini ya SMD padi;Igikorwa cyo gusudira cya LPI gisanzwe ntigishobora gukora cyuzuye mu mwobo nta ngaruka z'umuringa wambaye ubusa muri barrique.Mubisanzwe, irashobora gukoreshwa nyuma yerekana icapiro rya kabiri mugushyira UV cyangwa ubushyuhe bwakize epoxy yagurishijwe mukurwanya kugirango ucomeke;Yitwa binyuze mukuzitira.Gucomeka mu mwobo ni uguhagarika imyobo hamwe nibikoresho birwanya kugirango wirinde ko umwuka uva mugihe ugerageza isahani, cyangwa kugirango wirinde imiyoboro migufi yibintu hafi yubuso.


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